onsemi introduced its Embedded Power Platform, or EPP, on September 16, bringing power switches and their control chips into a common silicon package. The architecture moves key connections into wafer fabrication, giving designers a way to address electrical behavior and heat flow together as power equipment takes up more room in AI infrastructure. [1]
The connections between chips matter because a fast power switch depends on the signal reaching its control terminal cleanly. Existing Texas Instruments design guidance explains that circuit-board traces introduce parasitic inductance, an unintended electrical property that can distort rapid changes in current. Together with the switch's capacitance, it can produce voltage oscillations that trigger unwanted switching and increase losses. Designers therefore keep the outgoing and return signal paths close together to reduce the area of the current loop. [3]
EPP tackles interconnection inside the package. Its technical overview describes embedding semiconductor dies, the individual pieces of processed chip material, in silicon and connecting them with patterned metal redistribution layers. These layers replace wire-bond connections. Power transistors can share the structure with gate drivers, which command the switches, and controllers that coordinate their operation. onsemi says the shorter, controlled electrical paths reduce parasitic inductance. The platform can combine devices made from silicon, silicon carbide or gallium nitride, allowing different power-device technologies within the same packaging approach. [2]
The same package also provides the route for removing heat. According to the overview, conduction across its full footprint helps dissipate heat, while integrated high-voltage isolation reduces reliance on thermally inefficient insulating materials. Electrical isolation keeps parts of the circuit separated where voltage differences require it. Engineers can simulate electrical, thermal and mechanical behavior together, adjusting the design before building hardware. This matters because a connection chosen for switching performance also occupies space and affects the surrounding thermal design. [2]
The public evidence for the resulting performance remains preliminary. onsemi describes an early solid-state circuit-breaker design for AI infrastructure and reports a smaller, cooler implementation. Its announcement does not name the comparison design or supply the operating current, cooling conditions and temperature measurement needed to assess that result. The accompanying architecture overview explains the proposed mechanisms but provides no matched test table. These materials establish the design approach while leaving its advantage in a specified installation unverified. [1]
Customer evaluation is the next stage: onsemi expects sampling to begin in 2026, and Subaru will receive engineering samples and simulation models to explore future electrified vehicles. For power-system engineers, EPP offers an integration option to evaluate when separate connections and heat paths constrain a design. The useful next evidence is a comparison at the same voltage, current and cooling conditions, followed by reliability results for the intended application. [1]